Short: TSMC has announced that after constructing its 2Nm technology rollouts and 3Nm-class chips on its current lineup later this year, its A14 (1.4NM-class) chip construction process will enter production in 2028. The company says that the A14 represents a significant jump in both node performance and efficiency.
Roadmap was Unveiled This week in the North American Technology Seminar. As part of the announcement, TSMC revealed plans for an intermediary A16 node, slate for release in late 2026. This node will serve as a step stone towards the more transformative A14 process.
A major attraction of the A14 generation is the Nanoflex Pro, an extended transistor architecture that enables chip designers for optimal power, performance and fine-tune configuration for the optimal power, performance and field based on the specific requirements of each application.
While TSMC has not disclosed all technical details of the Nanoflex Pro, it is expected to manufacture the company’s existing finflex architecture, which allows designers to combine various standard cell types like high-demonstrations, low-power, or field-efficient cells-a single block. The Nanoflex Pro can also offer a fine-doubt control, potentially at the transistor level, or introduce smart design equipment to accelerate chip optimization.
Meanwhile, production is already ramping for TSMC’s third generation 3Nm-class process, N3p, which has officially entered out mass production in Q4 2024. As an optical contraction of N3E, N3p is now powering high -performing chips for customers in both data centers and advanced consumer technology sectors.
The next line is N3x, the second half of this year is expected to reach volume production. Sungged for maximum frequency, N3x provides an additional five percent performance benefit on N3P and supports voltage up to 1.2V, which is an unusually high border for 3Nm nodes. This client makes it particularly well suited for CPU and AI Accelerator that prefer raw speed on power efficiency.
TSMC deputy COO Kevin Zhang said that once the smartphone paved the way to adopt new nodes, AI Boom has reversed that trend. Today, AI chipmakers are the latest and the first to embrace the most advanced process technologies.
With N3p in full production, N3x on the track, and on the A14 horizon, TSMC is doubling its strategy to offer several node enriches to increase its major-composed fabs and customer IP’s life cycle. All of this is lined with a large scale of $ 40 billion in capital expenditure for 2025, which strengthens the status of the foundry as the major option for the world’s most advanced semi -circulators.
