something to look forward to: Intell’s struggle deteriorated last year to remain competitive in the semiconductor market as the company lost Arabs, forcing CEO Pat Gailinger. While the strategic direction of his successor remains unclear, initial statements suggest that Intel would maintain its commitment for Founders, even rivals proposed partnership and other people question whether Intel should stay in the foundry market.
Intel’s board has appointed Lip-Bow Tan, CEO of former cadns as its new leader. An industry veteran, Tan, has once vowed to restore the fate of the leading chip.
Tan previously served as CEOs of a major electronic system design company, Condenses Design Systems from 2009 to 2021, and was a member of the board from 2004 to 2023. He will also re -connect Intel’s Board of Directors after stepping into the last August.
Tan served as the CEO of a major electronic system design company, Condens Design Systems from 2009 to 2021 and served in his board from 2004 to 2023. He will re -join Intel’s Board of Directors after stepping on last August.
In a statement, Tan confirmed Intel’s ambition to re -establish himself as a world -class foundry, indicating that the company does not intend to leave the business, despite losing the ground for TSMC and Samsung. Former CEO Pat Gelsinger launched an ambitious plan to close the difference with the contestants, but suddenly resigned after several consecutive quarters last year.
Intel damaged more than $ 18 billion in 2024-its first annual loss after 1986. Meanwhile, TSMC, which dominates the state -of -the -art semiconductor market, reported the operational benefit of $ 41 billion during the same period.
Since Intel’s struggles became clear, various institutions have proposed to either buy Intel or take partial control over it. Recently, TSMC proposed a joint venture with Nvidia, AMD, Broadcom and Qualcomm to help most of the company’s people manage Intel’s founder under American ownership.
It is not clear that the Trump administration, which aims to maintain competitive against its Taiwan- and South Korea rivals, will support the deal.
Intel is pinching a lot of its future on its new 18A semiconductor process node, designed to compete with the upcoming N2 of TSMC. With the tape-out for the first half of this year, the 18A will introduce backside power delivery and a gate-all-round architecture from the 18A TSMC, planning to implement these techniques starting in 2026.
Initial analysis suggests that 18A can perform better than N2, but the real world comparison will have to wait until tangible products using two nodes. Nvidia and Broadcom are currently testing 18A, although there is no evidence yet they are planning to adopt it.
